Job Description

Job DescriptionAt Boeing we innovate and collaborate to make the world a better place. From the seabed to outer space you can contribute to work that matters with a company where diversity equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming respectful and inclusive with great opportunity for professional growth. Find your future with us.Within BR&T Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems.  We develop digital analog and RF Systems on Chip (SoCs) for radar navigation electronic warfare communications processing and other electronic systems. These systems are used on Boeing airborne terrestrial and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS GaAs GaN and SiGe. SSED uses external wafer fabrication but performs design (architecture RTL synthesis circuits physical design verification packaging and test) in house.  SSED has numerous microelectronics projects funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conduct research design and test microelectronics hardware in support of these projects.  You won’t be bored in our group!  Join us and put your passion determination and skill to work building the future! We are seeking a Mid-Level Microelectronics Packaging Engineer with a strong background in the current SOTA for advance packaging as it relates to microelectronics. A successful candidate will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements thermal-mechanical performance and design for manufactability and reliability. This role will be based in Annapolis Junction MD Huntington Beach CA or Huntsville AL. This position allows telecommuting. The selected candidate will be required to perform some work onsite at one of the listed location options.This position requires the ability to obtain a U.S Security Clearance for which the US Government requires US Citizenship. An interim and/or final US Secret clearance Post Start is required.Position Responsibilities: Leads advanced packaging analysis based on system requirements development of architectural approaches and detailed specificationsLeads advanced packaging design reviews of testing and analysis activity to assure compliance to program requirementsLeads activities in support of making recommendations for advanced packaging suppliers as well as EDA vendorsCoordinates engineering support throughout the lifecycle of the program productResolves complex issues on critical programs related to advanced packaging approaches requirements specifications and designLeads technical aspect of proposal preparation related to advanced packagingIdentifies critical performance metrics and develops processes to mitigate program risks for computing them.Demonstrated track record as a self-motived independent high-performance team memberExcellent verbal and written communication abilityBasic Qualifications (Required Skills/Experience):Bachelors Masters or Doctorate of Science degree from an accredited course of study in engineering computer science mathematics physics or chemistry1+ years of experience in the field of microelectronics packaging including MCM heterogeneous integration 3D chip stacking etcExperience with complex packaging architectures on circuit performance including speed thermal etcExperience with SWaP-C constrained electronics developmentExperience with EDA tool flow and vendor supports including but are not limited to chiplets floor-planning interposer design SiP optimization physical simulation and chiplets assemblyPreferred Qualifications (Desired Skills/Experience):Understanding and experience with design development and testing of advanced packaging techniques.  This includes conventional packaging techniques like ASIC BGA 2.5D / 3D heterogeneous integration and familiarity with commonly available supply chain for fabrication assembly packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products.Understanding of 3DIC development flow and tools; chip-level and substrate requirements architecture design and verification; foundry interface and fabrication; and final characterization and test including electrical mechanical and thermal considerations.Understanding of commercial microelectronics fabrication process technologies including standard substrates (organic silicon and glass) and PCB manufacturing processesHold patents in advanced microelectronics packaging architectures and performance improvementsExperience working building and managing Outsourced Assembly and Test (OSAT) vendor supply chainUnderstand various approaches and come up with strategies to mitigate Known Good Die (KGD) risks and improve functional SiP chip yieldExperience organizing and leading cross-functional engineering teams including internal and external organizationsExperience supporting proposals (technical cost and schedule) with advanced microelectronics packaging contentExperience with technical cost and schedule managementExperience supporting military programs including engagement with customersActive security clearanceTypical Education/Experience:Bachelors degree and typically 5 or more years experience in an engineering classification or a Masters degree with typically 3 or more years experience in an engineering classification or a PhD degree with experience in an engineering classification. Bachelor Master or Doctorate of Science degree from an accredited course of study in engineering computer science mathematics physics or chemistry. ABET is the preferred although not required accreditation standard.Relocation:This position offers relocation based on candidate eligibility.Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana cocaine opioids amphetamines PCP and alcohol when criteria is met as outlined in our policies.Shift:This position is for first shift.BRT_MSAEqual Opportunity Employer:Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race color religion national origin gender sexual orientation gender identity age physical or mental disability genetic factors military/veteran status or other characteristics protected by law.